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TNO Semicon Innovation Day
mei 21, 2019 @ 09:30 - 17:45
The semiconductor industry is driving many of today’s innovations and thereby generating new enabling technologies, addressing most of the Sustainable Development Goals. The smallest feature sizes are progressing towards the lower single digit nanometres and at the same time device integration has become three dimensional. Next to many challenges in production, a key challenge is – and will remain in the years to come – in metrology of markers, product features and defects. The Netherlands, as it is home to some of the enabling institutes and industries in this area, is proud of hosting the TNO Semicon Innovation Day on the 21st of May 2019 during the Dutch Technology Week.
The TNO Semicon Innovation Day will be focused around solutions on which TNO and its partners have been working in (near-field-) optics, (sub-surface) scanning probe microscopy, enabling opto-mechatronics and control innovations. It builds on and broadens the scope of our earlier workshops; ERP 3D Nanomanufacturing Dissemination and 3D Nanomanufacturing and Nanometrology.
This conference will bring together technology leaders from the major industry players and research institutes to discuss challenges, status of solutions, needed innovations and the ways forward for semicon metrology, contamination control and manufacturing. Please see the program below for information about the scheduled speakers and topics. After the event, you will be able to continue networking with your peers.
Conference subscription is open. Please register on this page. As places are limited, and also to allow best possible preparations, TNO kindly suggests timely registration.
If you have any questions please send an email to: email@example.com.
‘Make it visible’: focus on metrology
Welcome and opening | Arnold Stokking, Managing Director TNO Industry
Keynote talk by Samsung | Speaker to be announced
Invited talk: high throughput metrology solutions | Hamed Sadeghian, CTO Nearfield Instruments
Advances in SPM tomography | Paul van Neer, Senior Scientist, TNO
Photo thermal acoustic imaging | Wouter Koek, Senior Scientist, TNO
Speakers’ corner topics 1 and 2
Lunch and poster sessions
Speakers’ corner topics 3, 4 and 5
Invited talk by Intel | Sigal Ben-Tzvi, Intel Corp.
Near-field detection techniques | Giampiero Gerini, TNO, TU/e
Speakers’ corner: topics 6 and 7
Invited Talk: advances in hybrid metrology | Paul Hinnen, Program System Engineer Applications, ASML
Lab-on-an-instrument: concept and building blocks | Teun van den Dool, Senior Scientist, TNO
Break and poster sessions
EUV beam line – 2: new results and future developments | Norbert Koster, Principal Scientist, TNO
Cooperation TU/e TNO | Henk Nijmeijer, TU/e
Speakers’ corner: ‘what’s next’ and closure
Snacks and drinks
Speakers’ corner topics:
1. Overlay measurement tool | Stefan Kuiper, Senior System Architect, TNO
2. Bio-medical applications | Maurits van der Heiden, Senior System Architect, TNO
3. Contact hole / VIA manufacturing and measurement | Klará Maturová, Scientist, TNO
4. High throughput STED lithography | Arjen Boersma, Senior Scientist, TNO
5. Chemical imaging | Maarten van Es, Scientist, TNO
6. Artificial intelligence and defect detection | Speaker to be announced
7. Quantum sensing | Speaker to be announced
Date and Location
21st of May 2019, Science Center – Delft – The Netherlands